Optical Backplane Connector
SENKO'' Optical Backplane connector with AirMT™ technology offers excellent optical performance and stability. Blind mating technology connects up to 144 fibers using 24F MT ferrules.
These active blind-mate optical interconnects are revolutionary solutions for VPX systems and meet the stringent SWaP requirements of today's defense applications in which high-bandwidth fiber optic transceivers are...
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SENKO'' Optical Backplane connector with AirMT™ technology offers excellent optical performance and stability. Blind mating technology connects up to 144 fibers using 24F MT ferrules.
Shop DigiKey''s large in-stock selection of Backplane Connector Housings. View inventory, pricing and order now for same day shipping!
These dense and highly engineered interfaces have been utilized successfully for decades to enable scalable capacity systems for applications in core routing, optical switching and telecommunications.
High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to
HBMT features a blind-mate interface for easy insertion, removal, and exchange of the daughter card without disrupting the input/output ports or associated cabling. The connectors support
Whether the priority is a proven cost-optimized solution or the best performing backplane connector on the market, Amphenol is your source for reliable high-speed and high-density connectors.
The LightCONEX ® optical interconnect family includes plug-in and backplane module connectors that have been developed to be compliant with the forthcoming VITA 66.5 standard and in alignment with
Find your backplane connector easily amongst the 26 products from the leading brands (Smiths Interconnect, Hirose, VISHAY,) on DirectIndustry, the industry specialist for your professional
Our portfolio of backplane connectors features high-performance right angle, co-planar, and mezzanine interconnects, used for mating printed circuit boards together. TE engineers use sophisticated 3D
Utilizing the same external cable plugs for front panel and backplane applications, novel X, Y and Z floating mechanisms allow for generous mismatch between the card mounted and rack mounted