The key to assessing and testing CPO/NPO technology lies in the micro-connectors between ASIC internal switch chips and optical modules. We focus on testing the overall system's optical signal transmission quality and the comprehensive performance of optical ports. The CPO is a package in which an optical module and a Switch ASIC using silicon photonics (SiP) technology are mounted on a board with the minimum required area. -Evaluate the quality of optical. From Jensen Huang showcasing CPO switches at GTC 2025 to a wide range of vendors demonstrating optical engines integrated inside ASIC packages at OFC 2025, CPOs are everywhere. However, it's worth noting that Andy Bechtolsheim, co-founder of Arista and a long-standing visionary in data centre. Co-packaged optics (CPO) is emerging to respond to these demands, offering a way to integrate optical I/O directly with switch ASICs.
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