Conventional photonic packaging methods relying on edge or grating coupling are constrained by high insertion losses, limited bandwidth density, narrow band operation, and sensitivity to misalignment. Here we present a new fiber-to-chip coupling scheme based on free-form. Photonic interconnect technology has emerged as a critical enabler for high-performance computing, data centers, and telecommunications infrastructure, addressing the fundamental limitations of traditional electrical interconnects in terms of bandwidth, power consumption, and signal integrity. As. As photonic integrated circuits (PICs) move from laboratory prototypes to scalable quantum computing platforms, efficient and stable coupling between optical fibers and on-chip waveguides becomes a critical engineering requirement. The connection of these integrated photonic circuits to optical fiber arrays is often a challenge in terms of performance and. However, the optical packaging of integrated photonic devices with multiple I/O ports remains a slow and expensive process. We show a minimum coupling loss of 1. 1. In this paper, we describe the design overview and initial trials of a new, high density, Very Small Form Factor (VSFF) multi-fiber connector which exceeds the application and performance requirements of the MPO format.